|1930 - meetup|
|1900 BRMCW - vyuka telegrafie 2000 TalkNight|
This is an old revision of the document!
For IC analysis, you first need to expose the die. This process is called decapsulation. Silicon pr0n wiki has an extensive overview of methods. Methods that do not require lots of expensive equipment and we should try are:
Stripping individual layers of die to study underlying ones.